Toshiba scraps power semiconductor cooperation with Chinese wafer maker

Toshiba Ends Power Semiconductor Cooperation with Chinese Wafer Maker

Toshiba has scrapped its technical cooperation agreement with a Chinese wafer supplier due to economic security considerations.

The company's power semiconductor subsidiary will continue to source wafers from the Chinese supplier, despite ending the technology pact.

© Reuters

Toshiba's decision to end the agreement comes amid apparent economic security concerns over the deal.

Author's summary: Toshiba ends tech pact with Chinese wafer maker.

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Nikkei Asia Nikkei Asia — 2025-10-29